Cathodic
Arc Physical Vapor Deposition (PVD) 
Cathodic arc evaporation is the
most versatile of PVD coating technologies.
The process uses arc evaporation to create a highly ionized plasma.
This permits adherent coatings to be applied to low temperature substrates.
The system operates effectively on a broad range of substrate materials
and produces coatings with superior adhesion and performance:
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Titanium Nitride TiN
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Titanium Carbo-Nitride
TiCN
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Chromium Nitride CrN
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Titanium Aluminum Nitride
TiAlN
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Aluminum Titanium Nitride
AlTiN
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Zirconium Nitride ZrN
Enhanced Arc Physical Vapor Deposition
(PVD) is a patented deposition system utilizing high strength magnetic
fields in direct line of sight configuration to suppress macroparticle
emission. This results in the enhancement of plasma ionization, energy
and density and the near elimination of macroparticles in the deposited
film. High ionization assists in the substrate conditioning and promotes
excellent film adhesion particularly in the deposition of amorphous
diamond.
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MULTI-ARC®
and ION BOND® are registered
trademarks of Multi-Arc Inc.
Copyright © 1997 - Multi-Arc Inc. |
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