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Cathodic Arc Physical Vapor Deposition (PVD) Go 2 Info Source Page
Cathodic arc evaporation is the most versatile of PVD coating technologies.
The process uses arc evaporation to create a highly ionized plasma. This permits adherent coatings to be applied to low temperature substrates. The system operates effectively on a broad range of substrate materials and produces coatings with superior adhesion and performance:

  • Titanium Nitride TiN
  • Titanium Carbo-Nitride TiCN
  • Chromium Nitride CrN
  • Titanium Aluminum Nitride TiAlN
  • Aluminum Titanium Nitride AlTiN
  • Zirconium Nitride ZrN

Enhanced Arc Physical Vapor Deposition (PVD) is a patented deposition system utilizing high strength magnetic fields in direct line of sight configuration to suppress macroparticle emission. This results in the enhancement of plasma ionization, energy and density and the near elimination of macroparticles in the deposited film. High ionization assists in the substrate conditioning and promotes excellent film adhesion particularly in the deposition of amorphous diamond.

physical vapor deposition description, patented technology!
MULTI-ARC® and ION BOND are registered trademarks of Multi-Arc Inc.
Copyright 1997 - Multi-Arc Inc.
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